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XCKU5P-2FFVD900I

XCKU5P-2FFVD900I

XCKU5P-2FFVD900I

Xilinx Inc.

FPGAs Kintex? UltraScale+? Series 900-BBGA, FCBGA

SOT-23

XCKU5P-2FFVD900I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 900-BBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Kintex® UltraScale+™
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.39.00.01
Voltage - Supply 0.825V~0.876V
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 304
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 474600
Total RAM Bits 41984000
Number of LABs/CLBs 27120
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
XCKU5P-2FFVD900I Product Details

XCKU5P-2FFVD900I Overview


A 900-BBGA, FCBGA package contains it, and it is available for download. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. Fpga chips is programmed wFpga chipsh 304 I/Os for transferring data in a more coherent manner. A fundamental building block contains 474600 logic elements or cells. An FPGA module can be attached to a development board with a Surface Mount-pin. The supply voltage of the device is 0.825V~0.876V , at which it runs. The Kintex? UltraScale+? Series is one of the types of FPGAs that belong to this type. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. As a space-saving measure, this FPGA model is contained within Tray. The RAM bits that are offered by this fpga chips are 41984000. A total of 27120 LABs/CLBs make up this FPGA array.

XCKU5P-2FFVD900I Features


304 I/Os
Up to 41984000 RAM bits

XCKU5P-2FFVD900I Applications


There are a lot of Xilinx Inc. XCKU5P-2FFVD900I FPGAs applications.

  • ADAS
  • Industrial,Medical and Scientific Instruments
  • Medical ultrasounds
  • Ecosystem
  • Software-defined radios
  • Wired Communications
  • ASIC prototyping
  • Distributed Monetary Systems
  • Random logic
  • Telecommunication

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