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XCKU5P-3FFVA676E

XCKU5P-3FFVA676E

XCKU5P-3FFVA676E

Xilinx Inc.

FPGAs Kintex? UltraScale+? Series 676-BBGA, FCBGA

SOT-23

XCKU5P-3FFVA676E Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 676-BBGA, FCBGA
Operating Temperature0°C~100°C TJ
PackagingTray
Series Kintex® UltraScale+™
Part StatusActive
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code8542.39.00.01
Voltage - Supply 0.825V~0.876V
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 256
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 474600
Total RAM Bits 41984000
Number of LABs/CLBs 27120
RoHS StatusROHS3 Compliant
In-Stock:3058 items

XCKU5P-3FFVA676E Product Details

XCKU5P-3FFVA676E Overview


Fpga chips is supplied in the 676-BBGA, FCBGA package. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. The device has 256 I/O ports for more coherent data transfer. A fundamental building block consists of 474600 logic elements/cells. FPGA modules can be attached to development boards using a Surface Mount-connector. In order to operate it, it requires a voltage supply of 0.825V~0.876V . FPGAs belonging to the Kintex? UltraScale+? series are a type of FPGA that belong to the Kintex? UltraScale+? series of FPGAs. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~100°C TJ at all times. In order to save space, this FPGA model has been contained in Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 41984000 bFpga chipss. The FPGA is built as an array of 27120 latches or CLBs.

XCKU5P-3FFVA676E Features


256 I/Os
Up to 41984000 RAM bits

XCKU5P-3FFVA676E Applications


There are a lot of Xilinx Inc. XCKU5P-3FFVA676E FPGAs applications.

  • Scientific Instruments
  • Integrating multiple SPLDs
  • Electronic Warfare
  • Wireless Communications
  • Defense Applications
  • Digital signal processing
  • Military Temperature
  • Industrial,Medical and Scientific Instruments
  • Embedded Vision
  • Consumer Electronics

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