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XCMECH-FF1517

XCMECH-FF1517

XCMECH-FF1517

Xilinx Inc.

Mechanical Sample Specialized ICs

SOT-23

XCMECH-FF1517 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 18 Weeks
Mounting Type Surface Mount
Package / Case 1517-BBGA, FCBGA
Supplier Device Package 1517-FBGA (40x40)
Packaging Tray
Published 2012
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Type Mechanical Sample
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
6 $60.06000 $360.36
XCMECH-FF1517 Product Details

XCMECH-FF1517 Overview


Integrated circuit is enclosed in a package 1517-BBGA, FCBGA.The Tray package contains integrated circuit.Using Surface Mount, integrated circuit is mounted.This type of Mechanical Sample can be found in many integrated circuits.A 1517-FBGA (40x40) package is used to package the ICs complete.

XCMECH-FF1517 Features


Supplier Device Package : 1517-FBGA (40x40)

XCMECH-FF1517 Applications


There are a lot of Xilinx Inc. XCMECH-FF1517 Specialized ICs applications.

  • PC-Based Instruments
  • Printer Cartridge Identification and Authentication
  • Digital Still Cameras
  • MP3 Players
  • Authentication of Medical Sensors and Tools
  • Secure Management of Limited Use Consumables
  • Isolated CAN Bus Interface
  • Industrial Networks
  • Adapters requiring ultra low no-load consumption
  • IoT Node Authentication

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