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XCMECH-FF1760

XCMECH-FF1760

XCMECH-FF1760

Xilinx Inc.

Mechanical Sample Specialized ICs

SOT-23

XCMECH-FF1760 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 18 Weeks
Mounting Type Surface Mount
Package / Case 1760-BBGA, FCBGA
Supplier Device Package 1760-FCBGA (42.5x42.5)
Packaging Tray
Published 2012
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Type Mechanical Sample
RoHS Status ROHS3 Compliant
XCMECH-FF1760 Product Details

XCMECH-FF1760 Overview


The ICs is enclosed in the package 1760-BBGA, FCBGA.There is a package named Tray which includes this module.Surface Mount is used for mounting integrated circuit.There are a variety of integrated circuits for this type of Mechanical Sample.This ICs complete is packaged by 1760-FCBGA (42.5x42.5).

XCMECH-FF1760 Features


Supplier Device Package : 1760-FCBGA (42.5x42.5)

XCMECH-FF1760 Applications


There are a lot of Xilinx Inc. XCMECH-FF1760 Specialized ICs applications.

  • MP3 Players
  • Authentication of Medical Sensors and Tools
  • All converters requiring very low standby power
  • Industrial Networks
  • All AC-DC converters with X capacitors of 100 nF up to 6 mF
  • μP Switch Interfacing
  • Printer Cartridge Identification and Authentication
  • Anti-cloning
  • Message Security
  • Membrane Keypads

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