XCMECH-FF676 Overview

In the package 676-BBGA, FCBGA, the ICs is enclosed.It is used as integrated circuit system of the Tray package.Surface Mount is used for mounting integrated circuit.There are a variety of integrated circuits for this type of Mechanical Sample.A 676-FCBGA (27x27) package is used to package the ICs complete.

XCMECH-FF676 Features

Supplier Device Package : 676-FCBGA (27x27)

XCMECH-FF676 Applications

There are a lot of Xilinx Inc. XCMECH-FF676 Specialized ICs applications.

• Industrial Instruments
• Appliances requiring ErP Lot 6 compliance
• Cell Phones
• Secure Management of Limited Use Consumables
• Secure Download and Boot
• Anti-cloning
• DeviceNet Applications
• Isolated CAN Bus Interface
• MP3 Players
• Portable Instruments