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XCMECH-FFG1738

XCMECH-FFG1738

XCMECH-FFG1738

Xilinx Inc.

Mechanical Sample Specialized ICs

SOT-23

XCMECH-FFG1738 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 18 Weeks
Mounting Type Surface Mount
Package / Case 1738-BBGA, FCBGA
Supplier Device Package 1738-FCBGA (42.5x42.5)
Packaging Tray
Published 2012
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Type Mechanical Sample
RoHS Status ROHS3 Compliant
XCMECH-FFG1738 Product Details

XCMECH-FFG1738 Overview


1738-BBGA, FCBGA is the package that contains the ICs.There is a package named Tray which includes this module.Mounting is done using the Surface Mount method.Mechanical Sample is the type of the integrated circuit system.It is packaged by 1738-FCBGA (42.5x42.5) and is in good working order.

XCMECH-FFG1738 Features


Supplier Device Package : 1738-FCBGA (42.5x42.5)

XCMECH-FFG1738 Applications


There are a lot of Xilinx Inc. XCMECH-FFG1738 Specialized ICs applications.

  • Anti-cloning
  • Reference Design License Management
  • Isolated CAN Bus Interface
  • All converters requiring very low standby power
  • PDAs and Palmtop Devices
  • DeviceNet Applications
  • PC-Based Instruments
  • Industrial Instruments
  • Secure Download and Boot
  • Adapters requiring ultra low no-load consumption

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