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XCMECH-FFG668

XCMECH-FFG668

XCMECH-FFG668

Xilinx Inc.

Mechanical Sample Specialized ICs

SOT-23

XCMECH-FFG668 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 17 Weeks
Mounting Type Surface Mount
Package / Case 668-BBGA, FCBGA
Supplier Device Package 668-FCBGA (27x27)
Packaging Tray
Published 2012
Part Status Obsolete
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Type Mechanical Sample
RoHS Status RoHS Compliant
XCMECH-FFG668 Product Details

XCMECH-FFG668 Overview


668-BBGA, FCBGA is the package that contains the ICs.A package named Tray contains integrated circuit.Surface Mount is the way in which integrated circuit is mounted.Various integrated circuits use this type of Mechanical Sample.The ICs complete is packaged by 668-FCBGA (27x27).

XCMECH-FFG668 Features


Supplier Device Package : 668-FCBGA (27x27)

XCMECH-FFG668 Applications


There are a lot of Xilinx Inc. XCMECH-FFG668 Specialized ICs applications.

  • Peripheral Authentication
  • Secure Download and Boot
  • Industrial Networks
  • Cell Phones
  • IoT Node Authentication
  • Secure Management of Limited Use Consumables
  • DeviceNet Applications
  • Industrial Instruments
  • Lossless generation of zero crossing signal
  • Isolated CAN Bus Interface

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