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XCMECH-FFG676

XCMECH-FFG676

XCMECH-FFG676

Xilinx Inc.

Mechanical Sample Specialized ICs

SOT-23

XCMECH-FFG676 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 18 Weeks
Mounting Type Surface Mount
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Packaging Tray
Published 2012
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Type Mechanical Sample
RoHS Status ROHS3 Compliant
XCMECH-FFG676 Product Details

XCMECH-FFG676 Overview


The ICs is enclosed in the package 676-BBGA, FCBGA.Integrated circuit is included in the package Tray.A mounting method of Surface Mount is used.Various integrated circuits use this type of Mechanical Sample.The ICs complete is packaged by 676-FCBGA (27x27).

XCMECH-FFG676 Features


Supplier Device Package : 676-FCBGA (27x27)

XCMECH-FFG676 Applications


There are a lot of Xilinx Inc. XCMECH-FFG676 Specialized ICs applications.

  • Membrane Keypads
  • Message Security
  • All converters requiring very low standby power
  • Industrial Instruments
  • MP3 Players
  • Authentication of Medical Sensors and Tools
  • Lossless generation of zero crossing signal
  • Secure Download and Boot
  • IoT Node Authentication
  • Printer Cartridge Identification and Authentication

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