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XCV1000E-8FG860C

XCV1000E-8FG860C

XCV1000E-8FG860C

Xilinx Inc.

2.2mm mm FPGAs Virtex?-E Series 860-BGA 1mm mm 860

SOT-23

XCV1000E-8FG860C Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 860-BGA
Operating Temperature0°C~85°C TJ
PackagingTray
Published 1999
Series Virtex®-E
JESD-609 Code e0
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 860
ECCN Code 3A001.A.7.A
Terminal Finish Tin/Lead (Sn63Pb37)
HTS Code8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.71V~1.89V
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.8V
Terminal Pitch1mm
Reach Compliance Code not_compliant
[email protected] Reflow Temperature-Max (s) 30
Base Part Number XCV1000E
Pin Count860
JESD-30 Code S-PBGA-B860
Number of Outputs 660
Qualification StatusNot Qualified
Power Supplies1.2/3.61.8V
Number of I/O 660
RAM Size 48kB
Clock Frequency 416MHz
Number of Inputs 660
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 27648
Total RAM Bits 393216
Number of Gates1569178
Number of LABs/CLBs 6144
Combinatorial Delay of a CLB-Max 0.4 ns
Number of Equivalent Gates 331776
Height Seated (Max) 2.2mm
Length 42.5mm
Width 42.5mm
RoHS StatusNon-RoHS Compliant
Lead Free Contains Lead
In-Stock:4372 items

XCV1000E-8FG860C Product Details

XCV1000E-8FG860C Overview


In the package 860-BGA, this product is provided. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. The I/Os are designed to facilitate a more coherent transfer of data. To form a fundamental building block, there are 27648 logic elements/cells. 1.8V volts power it. An FPGA part from the Field Programmable Gate Arrays family. Surface Mount-connectors can be used to attach this FPGA module to the development board. Powered by a 1.71V~1.89V supply voltage, fpga chips is able to operate at high speeds. It is a type of FPGA belonging to the Virtex?-E seies. During the operation of the system, the operating temperature should remain within the range of 0°C~85°C TJ. This device is equipped with 660 separate outputs, which makes it a very versatile device. As a space-saving measure, this FPGA model is contained within Tray. 860 terminations are present in total. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 393216 bFpga chipss. Parts related to this part can be found using its base part number XCV1000E. The RAM si48kBe of this FPGA module reaches 48kB so as to guarantee the normal operation of the program during operation. This FPGA is built as an array of 6144 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. Power is provided by a 1.2/3.61.8V battery that is included with the device. Its basic building block contains 1569178 gates. There are a total of 860 pins on this device. Typically, fpga semiconductor uses a crystal oscillating at 416MHz . There are 331776 equivalent gates in the FPGA that implement the design.

XCV1000E-8FG860C Features


660 I/Os
Up to 393216 RAM bits

XCV1000E-8FG860C Applications


There are a lot of Xilinx Inc. XCV1000E-8FG860C FPGAs applications.

  • Wireless Communications
  • Software-defined radios
  • Distributed Monetary Systems
  • Security systems
  • DO-254
  • Radar and Sensors
  • Cryptography
  • Broadcast
  • Data Center
  • Server Applications

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