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XCV1600E-7BG560C

XCV1600E-7BG560C

XCV1600E-7BG560C

Xilinx Inc.

1.8V V FPGAs Virtex?-E Series 560-LBGA Exposed Pad, Metal 560

SOT-23

XCV1600E-7BG560C Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 560-LBGA Exposed Pad, Metal
Operating Temperature0°C~85°C TJ
PackagingTray
Published 2004
Series Virtex®-E
JESD-609 Code e0
Pbfree Code no
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 560
ECCN Code 3A991.D
HTS Code8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.71V~1.89V
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.8V
[email protected] Reflow Temperature-Max (s) 30
Base Part Number XCV1600E
Pin Count560
JESD-30 Code S-PBGA-B560
Number of Outputs 404
Operating Supply Voltage1.8V
Number of I/O 404
RAM Size 72kB
Clock Frequency 400MHz
Number of Inputs 404
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 34992
Total RAM Bits 589824
Number of Gates2188742
Number of LABs/CLBs 7776
Speed Grade 7
Combinatorial Delay of a CLB-Max 0.42 ns
Number of Equivalent Gates 419904
Length 42.5mm
Width 42.5mm
Radiation HardeningNo
RoHS StatusNon-RoHS Compliant
Lead Free Contains Lead
In-Stock:1879 items

XCV1600E-7BG560C Product Details

XCV1600E-7BG560C Overview


A 560-LBGA Exposed Pad, Metal package is provided with this component. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. 404 I/Os are available for transferring data more efficiently. The basic building blocks of logic contain 34992 logic elements/cells. Fpga chips is powered from a supply voltage of 1.8V. An FPGA part from the Field Programmable Gate Arrays family. The Surface Mount-slot connector on the FPGA module can be connected to the development board. This device is powered by a 1.71V~1.89V battery. As part of the Virtex?-E series of FPGAs, it is a type of FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~85°C TJ at all times. The device has 404 outputs that are integrated into it. It is for space saving reasons that this FPGA model is contained in Tray. Fpga chips is designed wFpga chipsh 560 terminations. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 589824 bFpga chipss. Related parts can be found by using its base part number XCV1600E. Fpga electronics is important that this FPGA module has a RAM si72kBe of 72kB in order to ensure that the program will run normally. A total of 7776 LABs/CLBs are included in this FPGA. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. Designers can fully utilize its flexibility with 1.8V supply voltage. Fpga semiconductor is made up of 2188742 gates as fpga semiconductors basic building block. There are a total of 560 pins on this device. Most of the time, it uses a crystal oscillating at 400MHz to generate the signal. There are 419904 equivalent gates implemented by the FPGA in order to implement the design.

XCV1600E-7BG560C Features


404 I/Os
Up to 589824 RAM bits

XCV1600E-7BG560C Applications


There are a lot of Xilinx Inc. XCV1600E-7BG560C FPGAs applications.

  • Software-defined radio
  • Automotive advanced driver assistance systems (ADAS)
  • Data center hardware accelerators
  • Electronic Warfare
  • Artificial intelligence (AI)
  • Space Applications
  • Radar and Sensors
  • Automotive
  • Voice recognition
  • Industrial Ethernet

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