1.8V V 1.7mm mm FPGAs Virtex?-E Series 560-LBGA Exposed Pad, Metal 1.27mm mm 560
SOT-23
XCV2000E-8BG560C Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
560-LBGA Exposed Pad, Metal
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2004
Series
Virtex®-E
JESD-609 Code
e0
Pbfree Code
no
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
560
ECCN Code
EAR99
Terminal Finish
Tin/Lead (Sn63Pb37)
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
1.71V~1.89V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
225
Supply Voltage
1.8V
Terminal Pitch
1.27mm
[email protected] Reflow Temperature-Max (s)
30
Base Part Number
XCV2000E
Pin Count
560
JESD-30 Code
S-PBGA-B560
Number of Outputs
404
Operating Supply Voltage
1.8V
Number of I/O
404
RAM Size
80kB
Clock Frequency
416MHz
Number of Inputs
404
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
43200
Total RAM Bits
655360
Number of Gates
2541952
Number of LABs/CLBs
9600
Speed Grade
8
Combinatorial Delay of a CLB-Max
0.4 ns
Height Seated (Max)
1.7mm
Length
42.5mm
Width
42.5mm
Radiation Hardening
No
RoHS Status
Non-RoHS Compliant
Lead Free
Contains Lead
XCV2000E-8BG560C Product Details
XCV2000E-8BG560C Overview
There is a 560-LBGA Exposed Pad, Metal package that includes this component. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. There are 404 I/Os for better data transfer. A fundamental building block is made up of 43200 logic elements/cells. It is powered from a supply voltage of 1.8V. In this case, the FPGA part belongs to the Field Programmable Gate Arrays family. Using a Surface Mount connector, you can mount this FPGA module on the development board. A supply voltage of 1.71V~1.89V is needed in order for fpga chips to operate. This is a type of FPGA that is part of the Virtex?-E series of FPGAs. When operating the machine, it is important to keep the temperature within 0°C~85°C TJ range. A total of 404 outputs are incorporated into this device. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Fpga chips is designed wFpga chipsh 560 terminations. As far as the RAM bits are concerned, this device offers you a total of 655360. You can find related parts by using the part number XCV2000E, which is its base part number. There is a maximum RAM si80kBe of 80kB on this FPGA module, which is necessary to ensure the normal operation of the program. 9600 LABs/CLBs are integrated into this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. The 1.8V supply voltage provides designers with full flexibility in their designs. 2541952 gates make up the basic block of its construction. As far as the pin count is concerned, it has 560 pins. A crystal oscillating at 416MHz is one of the most common components of this device.
XCV2000E-8BG560C Features
404 I/Os Up to 655360 RAM bits
XCV2000E-8BG560C Applications
There are a lot of Xilinx Inc. XCV2000E-8BG560C FPGAs applications.