1.8V V 1.7mm mm FPGAs Virtex?-E Series 352-LBGA Exposed Pad, Metal 1.27mm mm 352
SOT-23
XCV200E-6BG352C Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
352-LBGA Exposed Pad, Metal
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2006
Series
Virtex®-E
JESD-609 Code
e0
Pbfree Code
no
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
352
ECCN Code
3A991.D
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
1.71V~1.89V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
225
Supply Voltage
1.8V
Terminal Pitch
1.27mm
[email protected] Reflow Temperature-Max (s)
30
Base Part Number
XCV200E
Pin Count
352
JESD-30 Code
S-PBGA-B352
Number of Outputs
260
Operating Supply Voltage
1.8V
Number of I/O
260
RAM Size
14kB
Clock Frequency
357MHz
Number of Inputs
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
5292
Total RAM Bits
114688
Number of Gates
306393
Number of LABs/CLBs
1176
Speed Grade
6
Combinatorial Delay of a CLB-Max
0.47 ns
Height Seated (Max)
1.7mm
Length
35mm
Width
35mm
Radiation Hardening
No
RoHS Status
Non-RoHS Compliant
Lead Free
Contains Lead
XCV200E-6BG352C Product Details
XCV200E-6BG352C Overview
In the package 352-LBGA Exposed Pad, Metal, this product is provided. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. The I/Os are designed to facilitate a more coherent transfer of data. A fundamental building block consists of 5292 logic elements/cells. In order for the device to operate, a supply voltage of 1.8V volts needs to be provided. The Field Programmable Gate Arrays family of FPGAs includes this part. FPGA modules can be attached to development boards using a Surface Mount-connector. Fpga chips operates at a voltage of 1.71V~1.89V and uses a battery to supply power. The Virtex?-E Series is one of the types of FPGAs that belong to this type. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~85°C TJ when operating the machine. There are 260 outputs incorporated in this device. There is an FPGA model contained in Tray in order to conserve space. Total terminations are 352. There are 114688 RAM bits that are available with this device. Related parts can be found by using its base part number XCV200E. During the configuration of this FPGA module, the RAM si14kBe reaches 14kB to ensure that the program runs normally. 1176 LABs/CLBs are integrated into this FPGA. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. With a 1.8V supply voltage, designers can fully utilize the flexibility of the device. Fpga semiconductor is made up of 306393 gates as fpga semiconductors basic building block. The device has a total of 352 pins on fpga semiconductor. It usually uses a crystal oscillating at a frequency of 357MHz in order to do its work.
XCV200E-6BG352C Features
260 I/Os Up to 114688 RAM bits
XCV200E-6BG352C Applications
There are a lot of Xilinx Inc. XCV200E-6BG352C FPGAs applications.