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XCV200E-7BG352C

XCV200E-7BG352C

XCV200E-7BG352C

Xilinx Inc.

1.8V V FPGAs Virtex?-E Series 352-LBGA Exposed Pad, Metal 352

SOT-23

XCV200E-7BG352C Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 352-LBGA Exposed Pad, Metal
Operating Temperature0°C~85°C TJ
PackagingTray
Published 2004
Series Virtex®-E
JESD-609 Code e0
Pbfree Code no
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 352
ECCN Code 3A991.D
HTS Code8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.71V~1.89V
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.8V
[email protected] Reflow Temperature-Max (s) 30
Base Part Number XCV200E
Pin Count352
JESD-30 Code S-PBGA-B352
Number of Outputs 260
Operating Supply Voltage1.8V
Number of I/O 260
RAM Size 14kB
Clock Frequency 400MHz
Number of Inputs 260
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 5292
Total RAM Bits 114688
Number of Gates306393
Number of LABs/CLBs 1176
Speed Grade 7
Combinatorial Delay of a CLB-Max 0.42 ns
Number of Equivalent Gates 63504
Length 35mm
Width 35mm
Radiation HardeningNo
RoHS StatusNon-RoHS Compliant
Lead Free Contains Lead
In-Stock:4782 items

XCV200E-7BG352C Product Details

XCV200E-7BG352C Overview


A 352-LBGA Exposed Pad, Metal package contains it, and it is available for download. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. The I/Os are designed to facilitate a more coherent transfer of data. In order to construct a fundamental building block, 5292 logic elements/cells are required. The supply voltage is 1.8V volts. The Field Programmable Gate Arrays family of FPGAs includes this part. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 1.71V~1.89V-volt supply voltage required for the device to operate. The FPGA belongs to the Virtex?-E series of FPGAs, and it is one type of FPGA. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. During the installation of this device, 260 outputs were incorporated. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. There are a total of 352 terminations. This device is equipped with 114688 RAM bits in terms of its RAM si114688e. Related parts can be found by using its base part number XCV200E. The RAM si14kBe of this FPGA module reaches 14kB so as to guarantee the normal operation of the program during operation. 1176 LABs/CLBs are configured on this FPGA. Providing the FPGA is mounted in Surface Mount as per the specifications of the IC, then it should work perfectly according to its specifications. Design engineers can fully take advantage of its flexibility when operating at 1.8V supply voltage. A basic building block for this type of building block consists of 306393 gates. Fpga semiconductor is equipped wfpga semiconductorh 352 pin count. Most of the time, it uses a crystal oscillating at 400MHz to generate the signal. This design is implemented using 63504 equivalent gates on the FPGA.

XCV200E-7BG352C Features


260 I/Os
Up to 114688 RAM bits

XCV200E-7BG352C Applications


There are a lot of Xilinx Inc. XCV200E-7BG352C FPGAs applications.

  • High Performance Computing
  • Industrial IoT
  • Medical ultrasounds
  • Military DSP
  • Electronic Warfare
  • Ecosystem
  • Automotive
  • Audio
  • Digital signal processing
  • Data Center

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