1.8V V 1.7mm mm FPGAs Virtex?-E EM Series 560-LBGA Exposed Pad, Metal 1.27mm mm 560
SOT-23
XCV812E-8BG560C Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
560-LBGA Exposed Pad, Metal
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2002
Series
Virtex®-E EM
JESD-609 Code
e0
Pbfree Code
no
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
560
ECCN Code
3A991.D
Terminal Finish
Tin/Lead (Sn63Pb37)
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
1.71V~1.89V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
225
Supply Voltage
1.8V
Terminal Pitch
1.27mm
[email protected] Reflow Temperature-Max (s)
30
Base Part Number
XCV812E
Pin Count
560
JESD-30 Code
S-PBGA-B560
Number of Outputs
404
Operating Supply Voltage
1.8V
Number of I/O
404
RAM Size
140kB
Clock Frequency
416MHz
Number of Inputs
404
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
21168
Total RAM Bits
1146880
Number of Gates
254016
Number of LABs/CLBs
4704
Speed Grade
8
Combinatorial Delay of a CLB-Max
0.4 ns
Height Seated (Max)
1.7mm
Length
42.5mm
Width
42.5mm
Radiation Hardening
No
RoHS Status
Non-RoHS Compliant
Lead Free
Contains Lead
XCV812E-8BG560C Product Details
XCV812E-8BG560C Overview
There are two packages that contain fpga chips: 560-LBGA Exposed Pad, Metal package and X package. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. 404 I/Os are available for transferring data more efficiently. Logic elements/cells form the fundamental building block of a computer. It is powered from a supply voltage of 1.8V. An FPGA part from the Field Programmable Gate Arrays family. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates at a voltage of 1.71V~1.89V and uses a battery to supply power. FPGAs belonging to the Virtex?-E EM series are a type of FPGA that belong to the Virtex?-E EM series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. There are 404 outputs incorporated in this device. A model of this FPGA is contained in Tray for the purpose of saving space. There are a total of 560 terminations. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 1146880 bFpga chipss. You can find related parts by using the part number XCV812E, which is its base part number. For the program to work properly, the RAM si140kBe of this FPGA module must reach 140kB GB in order to ensure normal operation. The FPGA is built as an array of 4704 latches or CLBs. Providing the FPGA is mounted in Surface Mount as per the specifications of the IC, then it should work perfectly according to its specifications. Its flexibility can be fully utilized when operating with a 1.8V supply voltage. Among its basic building blocks, there are 254016 gates that are included in it. With a total of 560 pins, it is equipped with a high level of security. Fpga semiconductor typically uses a crystal oscillating at 416MHz.
XCV812E-8BG560C Features
404 I/Os Up to 1146880 RAM bits
XCV812E-8BG560C Applications
There are a lot of Xilinx Inc. XCV812E-8BG560C FPGAs applications.