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XCV812E-8BG560C

XCV812E-8BG560C

XCV812E-8BG560C

Xilinx Inc.

1.8V V 1.7mm mm FPGAs Virtex?-E EM Series 560-LBGA Exposed Pad, Metal 1.27mm mm 560

SOT-23

XCV812E-8BG560C Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 560-LBGA Exposed Pad, Metal
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2002
Series Virtex®-E EM
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 560
ECCN Code 3A991.D
Terminal Finish Tin/Lead (Sn63Pb37)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.71V~1.89V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.8V
Terminal Pitch 1.27mm
[email protected] Reflow Temperature-Max (s) 30
Base Part Number XCV812E
Pin Count 560
JESD-30 Code S-PBGA-B560
Number of Outputs 404
Operating Supply Voltage 1.8V
Number of I/O 404
RAM Size 140kB
Clock Frequency 416MHz
Number of Inputs 404
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 21168
Total RAM Bits 1146880
Number of Gates 254016
Number of LABs/CLBs 4704
Speed Grade 8
Combinatorial Delay of a CLB-Max 0.4 ns
Height Seated (Max) 1.7mm
Length 42.5mm
Width 42.5mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
XCV812E-8BG560C Product Details

XCV812E-8BG560C Overview


There are two packages that contain fpga chips: 560-LBGA Exposed Pad, Metal package and X package. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. 404 I/Os are available for transferring data more efficiently. Logic elements/cells form the fundamental building block of a computer. It is powered from a supply voltage of 1.8V. An FPGA part from the Field Programmable Gate Arrays family. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates at a voltage of 1.71V~1.89V and uses a battery to supply power. FPGAs belonging to the Virtex?-E EM series are a type of FPGA that belong to the Virtex?-E EM series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. There are 404 outputs incorporated in this device. A model of this FPGA is contained in Tray for the purpose of saving space. There are a total of 560 terminations. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 1146880 bFpga chipss. You can find related parts by using the part number XCV812E, which is its base part number. For the program to work properly, the RAM si140kBe of this FPGA module must reach 140kB GB in order to ensure normal operation. The FPGA is built as an array of 4704 latches or CLBs. Providing the FPGA is mounted in Surface Mount as per the specifications of the IC, then it should work perfectly according to its specifications. Its flexibility can be fully utilized when operating with a 1.8V supply voltage. Among its basic building blocks, there are 254016 gates that are included in it. With a total of 560 pins, it is equipped with a high level of security. Fpga semiconductor typically uses a crystal oscillating at 416MHz.

XCV812E-8BG560C Features


404 I/Os
Up to 1146880 RAM bits

XCV812E-8BG560C Applications


There are a lot of Xilinx Inc. XCV812E-8BG560C FPGAs applications.

  • Integrating multiple SPLDs
  • Defense Applications
  • Camera time adjustments
  • Distributed Monetary Systems
  • Server Applications
  • ADAS
  • Data center search engines
  • Ecosystem
  • Medical Applications
  • Automotive driver's assistance

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