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XCV812E-8FG900C

XCV812E-8FG900C

XCV812E-8FG900C

Xilinx Inc.

1.8V V 2.6mm mm FPGAs Virtex?-E EM Series 900-BBGA 1mm mm 900

SOT-23

XCV812E-8FG900C Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 900-BBGA
Number of Pins 900
Operating Temperature0°C~85°C TJ
PackagingTray
Published 1999
Series Virtex®-E EM
JESD-609 Code e0
Pbfree Code no
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 900
ECCN Code 3A991.D
Terminal Finish Tin/Lead (Sn63Pb37)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.71V~1.89V
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.8V
Terminal Pitch1mm
[email protected] Reflow Temperature-Max (s) 30
Base Part Number XCV812E
Pin Count900
Number of Outputs 556
Operating Supply Voltage1.8V
Number of I/O 556
RAM Size 140kB
Clock Frequency 416MHz
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 21168
Total RAM Bits 1146880
Number of Gates254016
Number of LABs/CLBs 4704
Speed Grade 8
Combinatorial Delay of a CLB-Max 0.4 ns
Height Seated (Max) 2.6mm
Length 31mm
Width 31mm
Radiation HardeningNo
RoHS StatusNon-RoHS Compliant
Lead Free Contains Lead
In-Stock:4287 items

XCV812E-8FG900C Product Details

XCV812E-8FG900C Overview


Fpga chips is supplied in the 900-BBGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. This device features 556 I/Os in order to transfer data in a more efficient manner. To form a fundamental building block, there are 21168 logic elements/cells. The supply voltage is 1.8V volts. This FPGA part belongs to the family of Field Programmable Gate Arrays. The Surface Mount-slot on the development board allows you to attach the FPGA module. A supply voltage of 1.71V~1.89V is needed in order for fpga chips to operate. The FPGA belongs to the Virtex?-E EM series of FPGAs, and it is one type of FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. With this device, you will be able to make use of 556 outputs. As a result of space limitations, this FPGA model has been included in Tray. Fpga chips is designed wFpga chipsh 900 terminations. This device is equipped with 1146880 RAM bits in terms of its RAM si1146880e. You can find related parts by using the part number XCV812E, which is its base part number. The RAM si140kBe of this FPGA module reaches 140kB so as to guarantee the normal operation of the program during operation. This cable has 900 pins and is designed to connect to a computer. An array of 4704 LABs/CLBs is built into the FPGA. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. A 1.8V-volt supply allows designers to fully utilize its flexibility. Among its basic building blocks, there are 254016 gates that are included in it. In addition to this, it has 900 pins. It usually uses a 416MHz crystal.

XCV812E-8FG900C Features


556 I/Os
Up to 1146880 RAM bits
900 LABs/CLBs

XCV812E-8FG900C Applications


There are a lot of Xilinx Inc. XCV812E-8FG900C FPGAs applications.

  • Wired Communications
  • ADAS
  • Secure Communication
  • Security systems
  • ASIC prototyping
  • High Performance Computing
  • Medical Electronics
  • Random logic
  • Software-defined radio
  • Industrial IoT

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