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XCVU095-3FFVC1517E

XCVU095-3FFVC1517E

XCVU095-3FFVC1517E

Xilinx Inc.

3.51mm mm FPGAs Virtex? UltraScale? Series 1517-BBGA, FCBGA 1mm mm

SOT-23

XCVU095-3FFVC1517E Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 1517-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~100°C TJ
Packaging Bulk
Published 2012
Series Virtex® UltraScale™
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
ECCN Code 3A001.A.7.B
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Voltage - Supply 0.970V~1.030V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch 1mm
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B1517
Number of I/O 520
Organization 768 CLBS
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 1176000
Total RAM Bits 62259200
Number of LABs/CLBs 67200
Number of CLBs 768
Height Seated (Max) 3.51mm
Length 40mm
Width 40mm
RoHS Status ROHS3 Compliant
XCVU095-3FFVC1517E Product Details

XCVU095-3FFVC1517E Overview


This package is included in the 1517-BBGA, FCBGA package and is available for purchase. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. Its 520 I/Os help it transfer data more efficiently. A fundamental building block consists of 1176000 logic elements/cells. It is powered from a supply voltage of 1V. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 0.970V~1.030V, this device operates with ease. It is a type of FPGA that belongs to the Virtex? UltraScale? series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~100°C TJ while the machine is operating. There is an FPGA model contained in Bulk in order to conserve space. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 62259200 bFpga chipss. This FPGA is built as an array of 67200 LABs/CLBs. There are 768 CLBs that make up the architecture of the system.

XCVU095-3FFVC1517E Features


520 I/Os
Up to 62259200 RAM bits

XCVU095-3FFVC1517E Applications


There are a lot of Xilinx Inc. XCVU095-3FFVC1517E FPGAs applications.

  • Device controllers
  • Medical ultrasounds
  • Cryptography
  • Solar Energy
  • Automation
  • Random logic
  • Automotive Applications
  • Industrial,Medical and Scientific Instruments
  • Military DSP
  • High Performance Computing

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