XCVU095-3FFVC2104E Overview

There are two packages that contain fpga chips: 2104-BBGA, FCBGA package and X package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. There are 416 I/Os for better data transfer. Logic blocks consist of 1176000 logic elements/cells. The supply voltage is 1V volts. FPGA modules can be attached to development boards using a Surface Mount-connector. Powered by a 0.970V~1.030V supply voltage, fpga chips is able to operate at high speeds. The Virtex? UltraScale? Series is one of the types of FPGAs that belong to this type. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~100°C TJ while the machine is operating. As a result of space limitations, this FPGA model has been included in Bulk. Fpga electronics is worth mentioning that this device provides 62259200 bfpga electronics s of RAM. 67200 LABs/CLBs are configured on this FPGA. An architecture consists of 768 CLBs.

XCVU095-3FFVC2104E Features

416 I/Os
Up to 62259200 RAM bits

XCVU095-3FFVC2104E Applications

There are a lot of Xilinx Inc. XCVU095-3FFVC2104E FPGAs applications.

• Secure Communication
• Ecosystem
• Camera time adjustments
• Radar and Sensors
• Consumer Electronics
• Enterprise networking
• Image processing
• Software-defined radio
• Aircraft navigation
• ADAS