XCVU11P-1FLGC2104I Overview

Fpga chips is supplied in the 2104-BBGA, FCBGA package. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. Its 416 I/Os help it transfer data more efficiently. Logic elements/cells form the fundamental building block of a computer. The Surface Mount-slot connector on the FPGA module can be connected to the development board. There is a 0.825V~0.876V-volt supply voltage required for the device to operate. The Virtex? UltraScale+? Series is one of the types of FPGAs that belong to this type. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. The RAM bits that are offered by this fpga chips are 396150400. The FPGA is built as an array of 162000 latches or CLBs.

XCVU11P-1FLGC2104I Features

416 I/Os
Up to 396150400 RAM bits

XCVU11P-1FLGC2104I Applications

There are a lot of Xilinx Inc. XCVU11P-1FLGC2104I FPGAs applications.

• Aircraft navigation
• Military Temperature
• Random logic
• Automotive
• Cryptography
• Aerospace and Defense
• Space Applications
• Solar Energy
• Artificial intelligence (AI)
• Embedded Vision