FPGAs Virtex? UltraScale+? Series 2104-BBGA, FCBGA
SOT-23
XCVU11P-1FSGD2104I Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Mounting Type
Surface Mount
Package / Case
2104-BBGA, FCBGA
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
Virtex® UltraScale+™
Part Status
Active
HTS Code
8542.39.00.01
Voltage - Supply
0.825V~0.876V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reach Compliance Code
not_compliant
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
572
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
2835000
Total RAM Bits
396150400
Number of LABs/CLBs
162000
RoHS Status
ROHS3 Compliant
XCVU11P-1FSGD2104I Product Details
XCVU11P-1FSGD2104I Overview
A 2104-BBGA, FCBGA package contains it, and it is available for download. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. The device has 572 I/O ports for more coherent data transfer. To form a fundamental building block, there are 2835000 logic elements/cells. FPGA modules can be attached to development boards using a Surface Mount-connector. There is a 0.825V~0.876V-volt supply voltage required for the device to operate. FPGAs belonging to the Virtex? UltraScale+? series are a type of FPGA that belong to the Virtex? UltraScale+? series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. As a space-saving measure, this FPGA model is contained within Tray. This device is equipped with 396150400 RAM bits in terms of its RAM si396150400e. A total of 162000 LABs/CLBs are included in this FPGA.
XCVU11P-1FSGD2104I Features
572 I/Os Up to 396150400 RAM bits
XCVU11P-1FSGD2104I Applications
There are a lot of Xilinx Inc. XCVU11P-1FSGD2104I FPGAs applications.