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XCVU125-3FLVC2104E

XCVU125-3FLVC2104E

XCVU125-3FLVC2104E

Xilinx Inc.

FPGAs Virtex? UltraScale? Series 2104-BBGA, FCBGA

SOT-23

XCVU125-3FLVC2104E Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Contact PlatingCopper, Silver, Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 2104-BBGA, FCBGA
Operating Temperature0°C~100°C TJ
PackagingTray
Series Virtex® UltraScale™
JESD-609 Code e1
Part StatusActive
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Voltage - Supply 0.970V~1.030V
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B2104
Number of I/O 416
RAM Size 11.1MB
Organization 1200 CLBS
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 1566600
Total RAM Bits 90726400
Number of LABs/CLBs 89520
Speed Grade 3
Number of Registers 1.43232e+06
Number of CLBs 1200
RoHS StatusROHS3 Compliant
In-Stock:3472 items

XCVU125-3FLVC2104E Product Details

XCVU125-3FLVC2104E Overview


The package that contains this software is called 2104-BBGA, FCBGA. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. This device features 416 I/Os in order to transfer data in a more efficient manner. A fundamental building block consists of 1566600 logic elements/cells. It is powered from a supply voltage of 1V. This FPGA module can be attached to the development board with a Surface Mount. The supply voltage of the device is 0.970V~1.030V , at which it runs. As part of the Virtex? UltraScale? series of FPGAs, it is a type of FPGA. The operating temperature should be kept at 0°C~100°C TJ when operating. As a result of space limitations, this FPGA model has been included in Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 90726400 bFpga chipss. There is a maximum RAM si11.1MBe of 11.1MB on this FPGA module, which is necessary to ensure the normal operation of the program. 89520 LABs and CLBs are built into this FPGA. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. During the process of storing and transferring data, 1.43232e+06 registers are used. In order to make the architecture work, 1200 CLBs are used.

XCVU125-3FLVC2104E Features


416 I/Os
Up to 90726400 RAM bits
1.43232e+06 registers

XCVU125-3FLVC2104E Applications


There are a lot of Xilinx Inc. XCVU125-3FLVC2104E FPGAs applications.

  • Voice recognition
  • Embedded Vision
  • Automotive driver's assistance
  • Industrial IoT
  • Software-defined radio
  • Consumer Electronics
  • Medical imaging
  • Electronic Warfare
  • Aircraft navigation
  • Development Boards and Shields for Microcontrollers

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