XCVU125-H1FLVB1760E Overview
Fpga chips is supplied in the 1760-BBGA, FCBGA package. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. A total of 702 I/Os allow data to be transferred in a more coherent manner. A fundamental building block contains 1566600 logic elements or cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. There is a 0.922V~1.030V-volt supply voltage required for the device to operate. As part of the Virtex? UltraScale? series of FPGAs, it is a type of FPGA. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~100°C TJ while the machine is operating. It is for space saving reasons that this FPGA model is contained in Tray. The RAM bits that this device offer is 90726400. A total of 89520 LABs/CLBs are included in this FPGA.
XCVU125-H1FLVB1760E Features
702 I/Os
Up to 90726400 RAM bits
XCVU125-H1FLVB1760E Applications
There are a lot of Xilinx Inc. XCVU125-H1FLVB1760E FPGAs applications.
- Data Center
- Enterprise networking
- Bioinformatics
- Camera time adjustments
- Wireless Communications
- Filtering and communication encoding
- Automation
- Broadcast
- Aerospace and Defense
- Data Mining
