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XCVU125-H1FLVB2104E

XCVU125-H1FLVB2104E

XCVU125-H1FLVB2104E

Xilinx Inc.

FPGAs Virtex? UltraScale? Series 2104-BBGA, FCBGA

SOT-23

XCVU125-H1FLVB2104E Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 2104-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Virtex® UltraScale™
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.39.00.01
Voltage - Supply 0.922V~1.030V
Number of I/O 702
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 1566600
Total RAM Bits 90726400
Number of LABs/CLBs 89520
RoHS Status ROHS3 Compliant
XCVU125-H1FLVB2104E Product Details

XCVU125-H1FLVB2104E Overview


Fpga chips is supplied in the 2104-BBGA, FCBGA package. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. Having 702 I/Os makes data transfers more coherent. A fundamental building block is made up of 1566600 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. With a supply voltage of 0.922V~1.030V, this device operates with ease. FPGAs belonging to the Virtex? UltraScale? series are a type of FPGA that belong to the Virtex? UltraScale? series of FPGAs. The operating temperature should be kept at 0°C~100°C TJ when operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. A device like this one offers 90726400 RAM bits, which is a considerable amount of memory. A total of 89520 LABs/CLBs are included in this FPGA.

XCVU125-H1FLVB2104E Features


702 I/Os
Up to 90726400 RAM bits

XCVU125-H1FLVB2104E Applications


There are a lot of Xilinx Inc. XCVU125-H1FLVB2104E FPGAs applications.

  • Voice recognition
  • Ecosystem
  • Video & Image Processing
  • Wired Communications
  • Industrial IoT
  • Enterprise networking
  • Defense Applications
  • Bioinformatics
  • High Performance Computing
  • Camera time adjustments

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