XCVU13P-1FHGB2104I Overview

There are two packages that contain fpga chips: 2104-BBGA, FCBGA package and X package. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. The device has 702 I/O ports for more coherent data transfer. A fundamental building block is made up of 3780000 logic elements/cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. Fpga chips operates wFpga chipsh a supply voltage of 0.825V~0.876V. The FPGA belongs to the Virtex? UltraScale+? series of FPGAs, and it is one type of FPGA. While operating, the operating temperature should be kept within a range of -40°C~100°C TJ. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. There are 514867200 RAM bits that are available with this device. An array of 216000 LABs/CLBs is built into the FPGA.

XCVU13P-1FHGB2104I Features

702 I/Os
Up to 514867200 RAM bits

XCVU13P-1FHGB2104I Applications

There are a lot of Xilinx Inc. XCVU13P-1FHGB2104I FPGAs applications.

• ADAS
• Industrial IoT
• Software-defined radio
• Telecommunication
• Defense Applications
• ASIC prototyping
• Solar Energy
• Medical Electronics
• Radar and Sensors
• Filtering and communication encoding