XCVU13P-1FHGC2104E Overview

As part of the 2104-BBGA, FCBGA package, it is included. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. The I/Os are designed to facilitate a more coherent transfer of data. A fundamental building block consists of 3780000 logic elements/cells. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates at a voltage of 0.825V~0.876V and uses a battery to supply power. As part of the Virtex? UltraScale+? series of FPGAs, it is a type of FPGA. While operating, the operating temperature should be kept within a range of 0°C~100°C TJ. In order to save space, this FPGA model has been contained in Tray. This device is equipped with 514867200 RAM bits in terms of its RAM si514867200e. The FPGA is built as an array of 216000 latches or CLBs.

XCVU13P-1FHGC2104E Features

416 I/Os
Up to 514867200 RAM bits

XCVU13P-1FHGC2104E Applications

There are a lot of Xilinx Inc. XCVU13P-1FHGC2104E FPGAs applications.

• Image processing
• Software-defined radio
• Artificial intelligence (AI)
• Automation
• Secure Communication
• Data center hardware accelerators
• Embedded Vision
• Medical Applications
• Aerospace and Defense
• Consumer Electronics