XCVU13P-1FIGD2104E Overview

There are two packages that contain fpga chips: 2104-BBGA, FCBGA package and X package. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. The I/Os are designed to facilitate a more coherent transfer of data. The basic building blocks of logic contain 3780000 logic elements/cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 0.825V~0.876V-volt supply voltage required for the device to operate. It is a type of FPGA that belongs to the Virtex? UltraScale+? series of FPGAs. The operating temperature should be kept at 0°C~100°C TJ when operating. As a space-saving measure, this FPGA model is contained within Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 514867200 bFpga chipss. 216000 LABs/CLBs are integrated into this FPGA.

XCVU13P-1FIGD2104E Features

676 I/Os
Up to 514867200 RAM bits

XCVU13P-1FIGD2104E Applications

There are a lot of Xilinx Inc. XCVU13P-1FIGD2104E FPGAs applications.

• Audio
• Industrial IoT
• Artificial intelligence (AI)
• Defense Applications
• Video & Image Processing
• Camera time adjustments
• Wired Communications
• Industrial,Medical and Scientific Instruments
• Automotive Applications
• Aerospace and Defense