XCVU13P-3FHGA2104E Overview

The package that contains this software is called 2104-BBGA, FCBGA. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 832 I/Os are programmed to ensure a more coherent data transfer. There are 3780000 logic elements/cells to form a fundamental building block. The Surface Mount-slot on the development board allows you to attach the FPGA module. In order for it to operate, the supply voltage must be 0.873V~0.927V . It is a type of FPGA that belongs to the Virtex? UltraScale+? series of FPGAs. When operating the machine, it is important to keep the temperature within 0°C~100°C TJ range. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Fpga electronics is worth mentioning that this device provides 514867200 bfpga electronics s of RAM. The FPGA consists of 216000 LABs/CLBs.

XCVU13P-3FHGA2104E Features

832 I/Os
Up to 514867200 RAM bits

XCVU13P-3FHGA2104E Applications

There are a lot of Xilinx Inc. XCVU13P-3FHGA2104E FPGAs applications.

• Enterprise networking
• Space Applications
• Scientific Instruments
• Automotive driver's assistance
• OpenCL
• Wireless Communications
• Development Boards and Shields for Microcontrollers
• Telecommunication
• Voice recognition
• Camera time adjustments