FPGAs Virtex? UltraScale+? Series 2104-BBGA, FCBGA
SOT-23
XCVU13P-L2FHGC2104E Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Mounting Type
Surface Mount
Package / Case
2104-BBGA, FCBGA
Operating Temperature
0°C~110°C TJ
Packaging
Tray
Published
2013
Series
Virtex® UltraScale+™
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.39.00.01
Voltage - Supply
0.698V~0.876V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reach Compliance Code
not_compliant
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
416
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
3780000
Total RAM Bits
514867200
Number of LABs/CLBs
216000
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCVU13P-L2FHGC2104E Product Details
XCVU13P-L2FHGC2104E Overview
Fpga chips is supplied in the 2104-BBGA, FCBGA package. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. Fpga chips is programmed wFpga chipsh 416 I/Os for transferring data in a more coherent manner. The basic building blocks of logic contain 3780000 logic elements/cells. With a Surface Mount connector, this FPGA module can be attached to the development board. A supply voltage of 0.698V~0.876V is needed in order for fpga chips to operate. There are many types of FPGAs in the Virtex? UltraScale+? series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~110°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 514867200 bFpga chipss. An array of 216000 LABs/CLBs is built into the FPGA.
XCVU13P-L2FHGC2104E Features
416 I/Os Up to 514867200 RAM bits
XCVU13P-L2FHGC2104E Applications
There are a lot of Xilinx Inc. XCVU13P-L2FHGC2104E FPGAs applications.