XCVU160-H1FLGC2104E Overview

Fpga chips is supplied in the 2104-BBGA, FCBGA package. The device has 416 I/O ports for more coherent data transfer. A fundamental building block is made up of 2026500 logic elements/cells. The Surface Mount-slot connector on the FPGA module can be connected to the development board. In order to operate it, it requires a voltage supply of 0.922V~1.030V . As part of the Virtex? UltraScale? series of FPGAs, it is a type of FPGA. The operating temperature should be kept at 0°C~100°C TJ when operating. As a space-saving measure, this FPGA model is contained within Tray. This device has 130969600 RAM bits, which is the number of RAM bits that this device offers. The FPGA consists of 115800 LABs/CLBs. The device package supplied by 2104-FCBGA (47.5x47.5) is one of its suppliers.

XCVU160-H1FLGC2104E Features

416 I/Os
Up to 130969600 RAM bits

XCVU160-H1FLGC2104E Applications

There are a lot of Xilinx Inc. XCVU160-H1FLGC2104E FPGAs applications.

• Wired Communications
• Filtering and communication encoding
• Random logic
• Solar Energy
• Industrial,Medical and Scientific Instruments
• ADAS
• Development Boards and Shields for Microcontrollers
• DO-254
• Data Mining
• Electronic Warfare