FPGAs Virtex? UltraScale+? Series 2104-BBGA, FCBGA
SOT-23
XCVU27P-1FIGD2104I Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Mounting Type
Surface Mount
Package / Case
2104-BBGA, FCBGA
Operating Temperature
-40°C~100°C TJ
Series
Virtex® UltraScale+™
Part Status
Active
Voltage - Supply
0.825V~0.876V
Number of I/O
676
Number of Logic Elements/Cells
2835000
Total RAM Bits
74344038
Number of LABs/CLBs
162000
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$53728.86000
$53728.86
500
$53191.5714
$26595785.7
1000
$52654.2828
$52654282.8
1500
$52116.9942
$78175491.3
2000
$51579.7056
$103159411.2
2500
$51042.417
$127606042.5
XCVU27P-1FIGD2104I Product Details
XCVU27P-1FIGD2104I Overview
Fpga chips is supplied in the 2104-BBGA, FCBGA package. There are 676 I/Os for better data transfer. The basic building blocks of logic contain 2835000 logic elements/cells. An FPGA module can be attached to a development board with a Surface Mount-pin. Fpga chips operates at a voltage of 0.825V~0.876V and uses a battery to supply power. This is a type of FPGA that is part of the Virtex? UltraScale+? series of FPGAs. While operating, the operating temperature should be kept within a range of -40°C~100°C TJ. Having a RAM bit size of 74344038 means that this device will offer you a lot of memory. The FPGA consists of 162000 LABs/CLBs.
XCVU27P-1FIGD2104I Features
676 I/Os Up to 74344038 RAM bits
XCVU27P-1FIGD2104I Applications
There are a lot of Xilinx Inc. XCVU27P-1FIGD2104I FPGAs applications.