XCVU29P-3FSGA2577E Overview

In the package 2577-BBGA, FCBGA, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. Its 448 I/Os help it transfer data more efficiently. To form a fundamental building block, there are 3780000 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. In order for it to operate, the supply voltage must be 0.825V~0.876V . It is a type of FPGA that belongs to the Virtex? UltraScale+? series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~100°C TJ when operating the machine. There are 99090432 RAM bits that are available with this device. The FPGA is built as an array of 216000 latches or CLBs.

XCVU29P-3FSGA2577E Features

448 I/Os
Up to 99090432 RAM bits

XCVU29P-3FSGA2577E Applications

There are a lot of Xilinx Inc. XCVU29P-3FSGA2577E FPGAs applications.

• Space Applications
• Bioinformatics
• Video & Image Processing
• Integrating multiple SPLDs
• Radar and Sensors
• Embedded Vision
• Data center search engines
• Automotive
• Camera time adjustments
• Ecosystem