XCVU29P-L2FSGA2577E Overview

There is a 2577-BBGA, FCBGA package that includes this component. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. There are 448 I/Os for better data transfer. There are 3780000 logic elements/cells to form a fundamental building block. The Surface Mount-slot on the development board allows you to attach the FPGA module. There is a 0.698V~0.742V-volt supply voltage required for the device to operate. This is a type of FPGA that is part of the Virtex? UltraScale+? series of FPGAs. During the operation of the system, the operating temperature should remain within the range of 0°C~100°C TJ. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 99090432 bFpga chipss. An array of 216000 LABs/CLBs is built into the FPGA.

XCVU29P-L2FSGA2577E Features

448 I/Os
Up to 99090432 RAM bits

XCVU29P-L2FSGA2577E Applications

There are a lot of Xilinx Inc. XCVU29P-L2FSGA2577E FPGAs applications.

• Device controllers
• Electronic Warfare
• Video & Image Processing
• Cryptography
• Server Applications
• ADAS
• Security systems
• Automation
• Ecosystem
• Automotive Applications