FPGAs Virtex? UltraScale+? Series 1517-BBGA, FCBGA
SOT-23
XCVU3P-1FFVC1517E Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Mounting Type
Surface Mount
Package / Case
1517-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Series
Virtex® UltraScale+™
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.39.00.01
Voltage - Supply
0.825V~0.876V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
520
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
862050
Total RAM Bits
130355200
Number of LABs/CLBs
49260
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$9,975.30000
$9
XCVU3P-1FFVC1517E Product Details
XCVU3P-1FFVC1517E Overview
As part of the 1517-BBGA, FCBGA package, it is included. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. The I/Os are designed to facilitate a more coherent transfer of data. A fundamental building block contains 862050 logic elements or cells. FPGA modules can be attached to development boards using a Surface Mount-connector. Powered by a 0.825V~0.876V supply voltage, fpga chips is able to operate at high speeds. An FPGA belonging to the Virtex? UltraScale+? series is referred to as an FPGA. Operating temperatures should be maintained within the 0°C~100°C TJ range at all times when the unit is in use. A model of this FPGA is contained in Tray for the purpose of saving space. This device has 130355200 RAM bits, which is the number of RAM bits that this device offers. 49260 LABs/CLBs are configured on this FPGA.
XCVU3P-1FFVC1517E Features
520 I/Os Up to 130355200 RAM bits
XCVU3P-1FFVC1517E Applications
There are a lot of Xilinx Inc. XCVU3P-1FFVC1517E FPGAs applications.