XCVU3P-2FFVC1517E Overview

Fpga chips is supplied in the 1517-BBGA, FCBGA package. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. A total of 520 I/Os allow data to be transferred in a more coherent manner. A fundamental building block contains 862050 logic elements or cells. FPGA modules can be attached to development boards using a Surface Mount-connector. In order for it to operate, the supply voltage must be 0.825V~0.876V . It is a type of FPGA belonging to the Virtex? UltraScale+? seies. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~100°C TJ when the device is operating. Using the Tray layout, this FPGA model can be contained in a very small amount of space. This device has 130355200 RAM bits, which is the number of RAM bits that this device offers. 49260 LABs/CLBs are integrated into this FPGA.

XCVU3P-2FFVC1517E Features

520 I/Os
Up to 130355200 RAM bits

XCVU3P-2FFVC1517E Applications

There are a lot of Xilinx Inc. XCVU3P-2FFVC1517E FPGAs applications.

• Camera time adjustments
• Space Applications
• Consumer Electronics
• Development Boards and Shields for Microcontrollers
• Defense Applications
• High Performance Computing
• Bioinformatics
• Electronic Warfare
• Automotive
• Scientific Instruments