XCVU3P-2FFVC1517I Overview

There are two packages that contain fpga chips: 1517-BBGA, FCBGA package and X package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. This device features 520 I/Os in order to transfer data in a more efficient manner. A fundamental building block contains 862050 logic elements or cells. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 0.825V~0.876V. It is a type of FPGA that belongs to the Virtex? UltraScale+? series of FPGAs. While operating, the operating temperature should be kept within a range of -40°C~100°C TJ. This FPGA model is contained in Tray for space saving. The RAM bits that this device offer is 118067200. A total of 49260 LABs/CLBs make up this FPGA array.

XCVU3P-2FFVC1517I Features

520 I/Os
Up to 118067200 RAM bits

XCVU3P-2FFVC1517I Applications

There are a lot of Xilinx Inc. XCVU3P-2FFVC1517I FPGAs applications.

• Cryptography
• Military DSP
• Server Applications
• Broadcast
• Medical Electronics
• Data Center
• Wireless Communications
• Voice recognition
• High Performance Computing
• Bioinformatics