XCVU3P-3FFVC1517E Overview

This package is included in the 1517-BBGA, FCBGA package and is available for purchase. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. Having 520 I/Os makes data transfers more coherent. In order to construct a fundamental building block, 862050 logic elements/cells are required. Using a Surface Mount connector, you can mount this FPGA module on the development board. With a supply voltage of 0.873V~0.927V, this device operates with ease. It is a type of FPGA that belongs to the Virtex? UltraScale+? series of FPGAs. The operating temperature should be kept at 0°C~100°C TJ when operating. It is for space saving reasons that this FPGA model is contained in Tray. There are 118067200 RAM bits that are available with this device. A total of 49260 LABs/CLBs make up this FPGA array.

XCVU3P-3FFVC1517E Features

520 I/Os
Up to 118067200 RAM bits

XCVU3P-3FFVC1517E Applications

There are a lot of Xilinx Inc. XCVU3P-3FFVC1517E FPGAs applications.

• DO-254
• Electronic Warfare
• Wired Communications
• Defense Applications
• ADAS
• Wireless Communications
• Development Boards and Shields for Microcontrollers
• Automotive
• Software-defined radios
• Broadcast