XCVU3P-L2FFVC1517E Overview

There are two packages that contain fpga chips: 1517-BBGA, FCBGA package and X package. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. This device features 520 I/Os in order to transfer data in a more efficient manner. To form a fundamental building block, there are 862050 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. There is a 0.698V~0.742V-volt supply voltage required for the device to operate. There are many types of FPGAs in the Virtex? UltraScale+? series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~110°C TJ while the machine is operating. There is an FPGA model contained in Tray in order to conserve space. A device like this one offers 130355200 RAM bits, which is a considerable amount of memory. The FPGA is built as an array of 49260 latches or CLBs.

XCVU3P-L2FFVC1517E Features

520 I/Os
Up to 130355200 RAM bits

XCVU3P-L2FFVC1517E Applications

There are a lot of Xilinx Inc. XCVU3P-L2FFVC1517E FPGAs applications.

• Wired Communications
• Automation
• Cryptography
• Military DSP
• Scientific Instruments
• Software-defined radios
• Defense Applications
• Data Mining
• Solar Energy
• Automotive Applications