XCVU7P-1FLVA2104E Overview
There are two packages that contain fpga chips: 2104-BBGA, FCBGA package and X package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. The I/Os are designed to facilitate a more coherent transfer of data. There are 1724100 logic elements/cells to form a fundamental building block. FPGA modules can be attached to development boards using a Surface Mount-connector. In order to operate it, it requires a voltage supply of 0.825V~0.876V . An FPGA belonging to the Virtex? UltraScale+? series is referred to as an FPGA. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~100°C TJ when operating the machine. In order to save space, this FPGA model has been contained in Tray. The RAM bits that are offered by this fpga chips are 260812800. This FPGA is built as an array of 98520 LABs/CLBs.
XCVU7P-1FLVA2104E Features
832 I/Os
Up to 260812800 RAM bits
XCVU7P-1FLVA2104E Applications
There are a lot of Xilinx Inc. XCVU7P-1FLVA2104E FPGAs applications.
- Integrating multiple SPLDs
- Embedded Vision
- Solar Energy
- Development Boards and Shields for Microcontrollers
- Military DSP
- Video & Image Processing
- Aerospace and Defense
- Automotive advanced driver assistance systems (ADAS)
- Scientific Instruments
- Device controllers
