XCVU7P-1FLVB2104I Overview

There are two packages that contain fpga chips: 2104-BBGA, FCBGA package and X package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. There are 702 I/Os for better data transfer. In order to construct a fundamental building block, 1724100 logic elements/cells are required. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Powered by a 0.825V~0.876V supply voltage, fpga chips is able to operate at high speeds. As part of the Virtex? UltraScale+? series of FPGAs, it is a type of FPGA. During the operation of the system, the operating temperature should remain within the range of -40°C~100°C TJ. It is for space saving reasons that this FPGA model is contained in Tray. Having a RAM bit size of 260812800 means that this device will offer you a lot of memory. 98520 LABs and CLBs are built into this FPGA.

XCVU7P-1FLVB2104I Features

702 I/Os
Up to 260812800 RAM bits

XCVU7P-1FLVB2104I Applications

There are a lot of Xilinx Inc. XCVU7P-1FLVB2104I FPGAs applications.

• Automotive advanced driver assistance systems (ADAS)
• Electronic Warfare
• Broadcast
• Server Applications
• Data Mining
• ASIC prototyping
• Secure Communication
• Military DSP
• Random logic
• OpenCL