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XCVU7P-2FLVB2104I

XCVU7P-2FLVB2104I

XCVU7P-2FLVB2104I

Xilinx Inc.

FPGAs Virtex? UltraScale+? Series 2104-BBGA, FCBGA

SOT-23

XCVU7P-2FLVB2104I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 17 Weeks
Mounting Type Surface Mount
Package / Case 2104-BBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Virtex® UltraScale+™
Part Status Active
HTS Code 8542.39.00.01
Voltage - Supply 0.825V~0.876V
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 702
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 1724100
Total RAM Bits 260812800
Number of LABs/CLBs 98520
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
XCVU7P-2FLVB2104I Product Details

XCVU7P-2FLVB2104I Overview


In the package 2104-BBGA, FCBGA, this product is provided. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. Fpga chips is programmed wFpga chipsh 702 I/Os for transferring data in a more coherent manner. To form a fundamental building block, there are 1724100 logic elements/cells. The Surface Mount-slot connector on the FPGA module can be connected to the development board. There is a 0.825V~0.876V-volt supply voltage required for the device to operate. The Virtex? UltraScale+? series FPGA is a type of FPGA that belongs to the Virtex? UltraScale+? family of FPGAs. When operating the machine, it is important to keep the temperature within -40°C~100°C TJ range. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. This device has 260812800 RAM bits, which is the number of RAM bits that this device offers. An array of 98520 LABs/CLBs is built into the FPGA.

XCVU7P-2FLVB2104I Features


702 I/Os
Up to 260812800 RAM bits

XCVU7P-2FLVB2104I Applications


There are a lot of Xilinx Inc. XCVU7P-2FLVB2104I FPGAs applications.

  • Data Mining
  • Enterprise networking
  • Software-defined radio
  • Medical imaging
  • Aircraft navigation
  • Solar Energy
  • Integrating multiple SPLDs
  • Scientific Instruments
  • Automotive driver's assistance
  • Artificial intelligence (AI)

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