FPGAs Virtex? UltraScale+? Series 2104-BBGA, FCBGA
SOT-23
XCVU9P-1FLGA2104E Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
13 Weeks
Mounting Type
Surface Mount
Package / Case
2104-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Series
Virtex® UltraScale+™
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.39.00.01
Voltage - Supply
0.825V~0.876V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reach Compliance Code
not_compliant
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
832
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
2586150
Total RAM Bits
391168000
Number of LABs/CLBs
147780
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCVU9P-1FLGA2104E Product Details
XCVU9P-1FLGA2104E Overview
In the 2104-BBGA, FCBGA package, you will find fpga chips. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. Fpga chips is programmed wFpga chipsh 832 I/Os for transferring data in a more coherent manner. A fundamental building block consists of 2586150 logic elements/cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. Powered by a 0.825V~0.876V supply voltage, fpga chips is able to operate at high speeds. As part of the Virtex? UltraScale+? series of FPGAs, it is a type of FPGA. The operating temperature should be kept at 0°C~100°C TJ when operating. In order to save space, this FPGA model has been contained in Tray. There are 391168000 RAM bits that are available with this device. This FPGA is built as an array of 147780 LABs/CLBs.
XCVU9P-1FLGA2104E Features
832 I/Os Up to 391168000 RAM bits
XCVU9P-1FLGA2104E Applications
There are a lot of Xilinx Inc. XCVU9P-1FLGA2104E FPGAs applications.
Bioinformatics
High Performance Computing
Distributed Monetary Systems
Embedded Vision
Voice recognition
DO-254
Development Boards and Shields for Microcontrollers