FPGAs Virtex? UltraScale+? Series 2577-BBGA, FCBGA
SOT-23
XCVU9P-2FLGA2577I Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
13 Weeks
Mounting Type
Surface Mount
Package / Case
2577-BBGA, FCBGA
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
Virtex® UltraScale+™
Part Status
Active
HTS Code
8542.39.00.01
Voltage - Supply
0.825V~0.876V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reach Compliance Code
not_compliant
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
448
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
2586150
Total RAM Bits
391168000
Number of LABs/CLBs
147780
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCVU9P-2FLGA2577I Product Details
XCVU9P-2FLGA2577I Overview
In the package 2577-BBGA, FCBGA, this product is provided. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. 448 I/Os are available for transferring data more efficiently. There are 2586150 logic elements/cells to form a fundamental building block. Surface Mount-connectors can be used to attach this FPGA module to the development board. In order for it to operate, the supply voltage must be 0.825V~0.876V . This is a type of FPGA that is part of the Virtex? UltraScale+? series of FPGAs. When operating the machine, it is important to keep the temperature within -40°C~100°C TJ range. This FPGA model is contained in Tray for space saving. The RAM bits that this device offer is 391168000. 147780 LABs/CLBs are configured on this FPGA.
XCVU9P-2FLGA2577I Features
448 I/Os Up to 391168000 RAM bits
XCVU9P-2FLGA2577I Applications
There are a lot of Xilinx Inc. XCVU9P-2FLGA2577I FPGAs applications.