XCVU9P-3FLGA2104E Overview

As part of the 2104-BBGA, FCBGA package, it is included. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 832 I/Os for transferring data in a more coherent manner. A fundamental building block consists of 2586150 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. Powered by a 0.873V~0.927V supply voltage, fpga chips is able to operate at high speeds. As part of the Virtex? UltraScale+? series of FPGAs, it is a type of FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~100°C TJ at all times. As a space-saving measure, this FPGA model is contained within Tray. This device has 391168000 RAM bits, which is the number of RAM bits that this device offers. The FPGA consists of 147780 LABs/CLBs.

XCVU9P-3FLGA2104E Features

832 I/Os
Up to 391168000 RAM bits

XCVU9P-3FLGA2104E Applications

There are a lot of Xilinx Inc. XCVU9P-3FLGA2104E FPGAs applications.

• Data Center
• Video & Image Processing
• Telecommunication
• Artificial intelligence (AI)
• Data center search engines
• Medical imaging
• Automotive advanced driver assistance systems (ADAS)
• Medical ultrasounds
• Aircraft navigation
• Voice recognition