XCVU9P-3FLGA2577E Overview

As part of the 2577-BBGA, FCBGA package, it is included. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. This device features 448 I/Os in order to transfer data in a more efficient manner. A fundamental building block consists of 2586150 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. Fpga chips operates wFpga chipsh a supply voltage of 0.873V~0.927V. The FPGA belongs to the Virtex? UltraScale+? series of FPGAs, and it is one type of FPGA. The operating temperature should be kept at 0°C~100°C TJ when operating. There is an FPGA model contained in Tray in order to conserve space. A device like this one offers 391168000 RAM bits, which is a considerable amount of memory. 147780 LABs/CLBs are configured on this FPGA.

XCVU9P-3FLGA2577E Features

448 I/Os
Up to 391168000 RAM bits

XCVU9P-3FLGA2577E Applications

There are a lot of Xilinx Inc. XCVU9P-3FLGA2577E FPGAs applications.

• Image processing
• Voice recognition
• Automotive advanced driver assistance systems (ADAS)
• Aerospace and Defense
• Automotive driver's assistance
• Industrial IoT
• Industrial Ethernet
• DO-254
• Aircraft navigation
• Medical Electronics