FPGAs Virtex? UltraScale+? Series 2104-BBGA, FCBGA
SOT-23
XCVU9P-3FLGB2104E Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
13 Weeks
Mounting Type
Surface Mount
Package / Case
2104-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Series
Virtex® UltraScale+™
Part Status
Active
HTS Code
8542.39.00.01
Voltage - Supply
0.873V~0.927V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reach Compliance Code
not_compliant
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
702
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
2586150
Total RAM Bits
391168000
Number of LABs/CLBs
147780
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCVU9P-3FLGB2104E Product Details
XCVU9P-3FLGB2104E Overview
A 2104-BBGA, FCBGA package contains it, and it is available for download. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. Having 702 I/Os makes data transfers more coherent. A fundamental building block consists of 2586150 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. With a supply voltage of 0.873V~0.927V, this device operates with ease. This is a type of FPGA that is part of the Virtex? UltraScale+? series of FPGAs. The operating temperature should be kept at 0°C~100°C TJ when operating. In order to save space, this FPGA model has been contained in Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 391168000 bFpga chipss. The FPGA consists of 147780 LABs/CLBs.
XCVU9P-3FLGB2104E Features
702 I/Os Up to 391168000 RAM bits
XCVU9P-3FLGB2104E Applications
There are a lot of Xilinx Inc. XCVU9P-3FLGB2104E FPGAs applications.