FPGAs Virtex? UltraScale+? Series 2104-BBGA, FCBGA
SOT-23
XCVU9P-L2FLGA2104E Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
13 Weeks
Mounting Type
Surface Mount
Package / Case
2104-BBGA, FCBGA
Operating Temperature
0°C~110°C TJ
Packaging
Tray
Series
Virtex® UltraScale+™
Part Status
Active
HTS Code
8542.39.00.01
Voltage - Supply
0.698V~0.742V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reach Compliance Code
not_compliant
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
832
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
2586150
Total RAM Bits
391168000
Number of LABs/CLBs
147780
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCVU9P-L2FLGA2104E Product Details
XCVU9P-L2FLGA2104E Overview
There are two packages that contain fpga chips: 2104-BBGA, FCBGA package and X package. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. There are 832 I/Os for better data transfer. In order to construct a fundamental building block, 2586150 logic elements/cells are required. The Surface Mount-slot on the development board allows you to attach the FPGA module. In order for it to operate, the supply voltage must be 0.698V~0.742V . It is a type of FPGA belonging to the Virtex? UltraScale+? seies. Operating temperatures should be maintained within the 0°C~110°C TJ range at all times when the unit is in use. This FPGA model is contained in Tray for space saving. The RAM bits that this device offer is 391168000. A total of 147780 LABs/CLBs are included in this FPGA.
XCVU9P-L2FLGA2104E Features
832 I/Os Up to 391168000 RAM bits
XCVU9P-L2FLGA2104E Applications
There are a lot of Xilinx Inc. XCVU9P-L2FLGA2104E FPGAs applications.