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XCVU9P-L2FLGC2104E

XCVU9P-L2FLGC2104E

XCVU9P-L2FLGC2104E

Xilinx Inc.

FPGAs Virtex? UltraScale+? Series 2104-BBGA, FCBGA

SOT-23

XCVU9P-L2FLGC2104E Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 13 Weeks
Mounting Type Surface Mount
Package / Case 2104-BBGA, FCBGA
Operating Temperature 0°C~110°C TJ
Packaging Tray
Series Virtex® UltraScale+™
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.39.00.01
Voltage - Supply 0.698V~0.742V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code not_compliant
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 416
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 2586150
Total RAM Bits 391168000
Number of LABs/CLBs 147780
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
XCVU9P-L2FLGC2104E Product Details

XCVU9P-L2FLGC2104E Overview


A 2104-BBGA, FCBGA package is provided with this component. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. The I/Os are designed to facilitate a more coherent transfer of data. Logic elements/cells form the fundamental building block of a computer. By attaching the Surface Mount connector, you can use this FPGA module with your development board. In order for it to operate, the supply voltage must be 0.698V~0.742V . An FPGA belonging to the Virtex? UltraScale+? series is referred to as an FPGA. During the operation of the system, the operating temperature should remain within the range of 0°C~110°C TJ. Using the Tray layout, this FPGA model can be contained in a very small amount of space. This device is equipped with 391168000 RAM bits in terms of its RAM si391168000e. The FPGA is built as an array of 147780 latches or CLBs.

XCVU9P-L2FLGC2104E Features


416 I/Os
Up to 391168000 RAM bits

XCVU9P-L2FLGC2104E Applications


There are a lot of Xilinx Inc. XCVU9P-L2FLGC2104E FPGAs applications.

  • Data Center
  • Ecosystem
  • Artificial intelligence (AI)
  • Distributed Monetary Systems
  • Aerospace and Defense
  • Image processing
  • Automotive driver's assistance
  • Consumer Electronics
  • Industrial Ethernet
  • Filtering and communication encoding

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