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XCZU19EG-2FFVD1760I

XCZU19EG-2FFVD1760I

XCZU19EG-2FFVD1760I

Xilinx Inc.

-40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 308 I/O

SOT-23

XCZU19EG-2FFVD1760I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Package / Case 1760-BBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC EG
Published 2016
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 308
Speed 533MHz, 600MHz, 1.3GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $8,675.19000 $8
XCZU19EG-2FFVD1760I Product Details

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


A Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 1760-BBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq® UltraScale+™ MPSoC EG series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells.Housed in the state-of-art Tray package.308 I/Os in total are included in this SoC part.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.


There are a lot of Xilinx Inc.


XCZU19EG-2FFVD1760I System On Chip (SoC) applications.


  • Automotive gateway
  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors

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