Welcome to Hotenda.com Online Store!

logo
userjoin
Home

XCZU19EG-L2FFVD1760E

XCZU19EG-L2FFVD1760E

XCZU19EG-L2FFVD1760E

Xilinx Inc.

0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 308 I/O 0.72V

SOT-23

XCZU19EG-L2FFVD1760E Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Package / Case 1760-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC EG
Published 2016
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B1760
Supply Voltage-Max (Vsup) 0.742V
Supply Voltage-Min (Vsup) 0.698V
Number of I/O 308
Speed 533MHz, 600MHz, 1.3GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $8,675.19000 $8
XCZU19EG-L2FFVD1760E Product Details

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


A core processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 is used to build this SoC.Its package is 1760-BBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq® UltraScale+™ MPSoC EG series.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.A key point to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 308.A 0.72V power supply should be used.There are voltages higher than 0.742V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 0.698V.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.The SoC processor also includes ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY, which are additional features.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY


There are a lot of Xilinx Inc.


XCZU19EG-L2FFVD1760E System On Chip (SoC) applications.


  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports

Related Part Number

XC7Z010-1CLG225C
XC7Z010-1CLG225C
$0 $/piece
XCZU11EG-L2FFVC1760E
XC7Z010-1CLG225I
XC7Z010-1CLG225I
$0 $/piece
XCZU11EG-2FFVC1760I
XCZU17EG-1FFVC1760E
XCZU19EG-2FFVC1760E
XCZU19EG-3FFVC1760E
XCZU11EG-3FFVC1760E
M2S060-FG676
XCZU19EG-2FFVC1760I

Get Subscriber

Enter Your Email Address, Get the Latest News