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XCZU2EG-3SFVA625E

XCZU2EG-3SFVA625E

XCZU2EG-3SFVA625E

Xilinx Inc.

625 Terminations 0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 180 I/O 0.9V

SOT-23

XCZU2EG-3SFVA625E Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Package / Case 625-BFBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC EG
Published 2013
Part Status Obsolete
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 625
Terminal Position BOTTOM
Terminal Form BALL
Supply Voltage 0.9V
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B625
Number of I/O 180
Speed 600MHz, 667MHz, 1.5GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
XCZU2EG-3SFVA625E Product Details

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


On this SoC, there is Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor.Assigned with the package 625-BFBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Zynq® UltraScale+™ MPSoC EG series.Temperatures should be 0°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines Zynq®UltraScale+™ FPGA, 103K+ Logic Cells.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 180 I/Os.It is recommended to use a 0.9V power supply.In total, there are 625 terminations, which is great for system on a chip.For its uPs/uCs/peripheral SoCs, it uses MICROPROCESSOR CIRCUIT.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT


There are a lot of Xilinx Inc.


XCZU2EG-3SFVA625E System On Chip (SoC) applications.


  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices

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