625 Terminations 0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 180 I/O 0.9V
SOT-23
XCZU2EG-3SFVA625E Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Package / Case
625-BFBGA, FCBGA
Surface Mount
YES
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Series
Zynq® UltraScale+™ MPSoC EG
Published
2013
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
625
Terminal Position
BOTTOM
Terminal Form
BALL
Supply Voltage
0.9V
Reach Compliance Code
compliant
JESD-30 Code
S-PBGA-B625
Number of I/O
180
Speed
600MHz, 667MHz, 1.5GHz
RAM Size
256KB
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
XCZU2EG-3SFVA625E Product Details
This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).
On this SoC, there is Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor.Assigned with the package 625-BFBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Zynq® UltraScale+™ MPSoC EG series.Temperatures should be 0°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines Zynq®UltraScale+™ FPGA, 103K+ Logic Cells.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 180 I/Os.It is recommended to use a 0.9V power supply.In total, there are 625 terminations, which is great for system on a chip.For its uPs/uCs/peripheral SoCs, it uses MICROPROCESSOR CIRCUIT.
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.
256KB RAM. Built on MCU, FPGA. MICROPROCESSOR CIRCUIT
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