784 Terminations 0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 252 I/O 0.9V
SOT-23
XCZU2EG-3SFVC784E Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
25 Weeks
Package / Case
784-BFBGA, FCBGA
Surface Mount
YES
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Series
Zynq® UltraScale+™ MPSoC EG
Published
2013
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
784
HTS Code
8542.31.00.01
Terminal Position
BOTTOM
Terminal Form
BALL
Supply Voltage
0.9V
Reach Compliance Code
compliant
JESD-30 Code
S-PBGA-B784
Number of I/O
252
Speed
600MHz, 667MHz, 1.5GHz
RAM Size
256KB
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
XCZU2EG-3SFVC784E Product Details
This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).
A Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 784-BFBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq® UltraScale+™ MPSoC EG series.The average operating temps for this SoC meaning should be 0°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Zynq®UltraScale+™ FPGA, 103K+ Logic Cells.Housed in the state-of-art Tray package.252 I/Os in total are included in this SoC part.It is advised to utilize a 0.9V power supply.There are 784 terminations in total and that really benefits system on a chip.It uses MICROPROCESSOR CIRCUIT as a uPs/uCs/Peripheral SoC.
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.
256KB RAM. Built on MCU, FPGA. MICROPROCESSOR CIRCUIT
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